I-Shenzhen Chinasky Laser Technology Co., Ltd. yenye yezona zinto zinobuchule kunye nabanikezeli be-uv laser cutting machine e-China. Nceda uqiniseke ukuba uthenge umatshini wokusika we-uv laser okumgangatho ophezulu kunye newaranti yeminyaka emi-2 kumzi-mveliso wethu. Sikwazamkela iiodolo ezilungiselelwe wena.
Uphawu kunye ne-Advanteji
Ukuhambelana kwezinto ezibanzi
Isetyenzwa ngokufanelekileyo imathiriyeli enzima ngezinye iilaser, kubandakanywa iiplastiki, iiseramikhi, iglasi, kunye neentsimbi ezibonisa kakhulu njengobhedu kunye ne-aluminiyam.
IiNkqubo zeMotion eziPhezulu
{0}}Iinjini ezichanekileyo ezichanekileyo kunye neeskena zegalvanometer zibonelela ngesantya esingahambelaniyo kunye nokuchaneka kweendlela zokusika ezintsonkothileyo.
Ulungelelwaniso loMbono oluDityanisiweyo
{0}}Iekhamera zokulungiswa okuphezulu ngokuzenzekelayo zifumana kwaye zilungelelanise ukusikeka kumanqaku e-fiducial okanye iipateni, ziqinisekisa ukuchaneka okubalulekileyo kwe-PCB kunye namacandelo e-semiconductor.
IiNdawo zokuSebenza eziLungileyo
Ifaka ubukhulu be-460 mm x 460 mm ubukhulu boluhlu olusebenzayo lwelaser kwiipaneli ezinkulu okanye uluhlu oluphindaphindiweyo, ecaleni kwendawo echanekileyo eyi-50 mm x 50 mm encinci{4}}yendawo yokusetyenzwa. Olu luhlu lubini-isakhono soluhlu lubonelela ngokuguquguquka okungalinganiyo, ukusuka ekusetyenzweni okukhulu{7}} kwemathiriyeli yefomati ukuhla ukuya kumatshini ontsonkothileyo kakhulu, amacandelo amancinci ngokuchaneka okuphezulu.
Database yeNkqubo ekrelekrele
I-database ebanzi ivumela abathengi ukuba bakhe kwaye bagcine iilayibrari zeeparameter ezikhethekileyo kwimveliso nganye. Oku kuphelisa iimpazamo ezenziwa ngesandla kwaye kuqinisekisa iziphumo ezingenasiphako, eziphindaphindwayo kungakhathaliseki ukuba ngamava omqhubi.
Phezulu-iSpeed Precision Motion System (XY-Axis)
Ixhotyiswe ngeqonga lentshukumo eliphezulu-elinika isantya esikhawulezayo se-800 mm/s kunye nesantya esiphezulu se-1G. Oku kuqinisekisa ukuma okukhawulezayo kwaye kunciphisa kakhulu{4}}ukungasikwa kwexesha lokungenzi nto, konyusa ngokubonakalayo ukugqiba kunye nokusebenza kakuhle kwimveliso yebhetshi encinci kunye nenkulu.
Ukusebenza kweSoftware eLungeneyo
Ujongano lwesoftware lubandakanya imisebenzi enengqondo efana "nokuSika okuKhethiweyo," "Isixhobo{0}}Ukusika okuSekwe kwiSithili," kunye "neMithi{1}}IiSeti eziKhethekileyo zeParameter." Oku kwenza kube lula ukuseta umsebenzi onzima kunqakrazo olumbalwa, ukunciphisa ixesha loqeqesho lwabaqhubi kunye nokuthintela iimpazamo.
Imbali yeMveliso eSebenzayo kunye nokuKhumbula
Inkqubo irekhoda ngokuzenzekelayo idatha epheleleyo yokusika kuyo yonke imveliso. Ukutshintsha imisebenzi, abaqhubi bakhetha ngokulula igama lemveliso kuluhlu ukuze bakhumbule ngoko nangoko zonke iiparamitha, ukwenza utshintsho olukhawulezayo kunye nokuphelisa iimpazamo zokuseta kwiimveliso eziqinisekisiweyo.
Ulawulo oluPhezulu loMsebenzisi kunye neNdlela yoPhicotho-zincwadi ibonelela
Abalawuli abanezixhobo ezinamandla zokubeka iliso. Inkqubo ibhala ngokuzenzekela wonke umsebenzi wabasebenzisi, ukuquka ukungena/ukuphuma kwamaxesha, lonke utshintsho lweparameter eyenziweyo, kunye nembali epheleleyo yeefayile ezisikiweyo ezisetyenzisiweyo. Oku kuqinisekisa ukulandeleka okupheleleyo kunye nokuphendula kunye noncedo ekuxilongeni ulawulo lomgangatho.
Isicelo
- ISemiconductor kunye ne-IC Packaging:I-Wafer dicing (i-singulation), ukusika i-silicon, ukusika i-ceramic substrate, kunye nokulungiswa kweefreyimu zelothe.
- I-Flexible Electronics (FPC):Ukusika ngokuchanekileyo kunye nokugrunjwa kweeSekethe eziprintiweyo zeFlexible (FPC), ii-coverlays, kunye ne-polyimide encinci (PI) kunye ne-PET layers.
- Ubunjineli obuchanekileyo:Ukusika iintsimbi ezicekethekileyo (ikopolo, iifoyile zealuminiyam), ukuyila imicro-iinkqubo ze-electromechanical (MEMS), kunye nokuyila imida emihle kunye nezihluzi.
- Ii-Electronics zabathengi:Ukusika iglasi kunye nesafire kwiimodyuli zekhamera, i-sensors touch, kunye nezixhobo zokubonisa; ukuphawula kunye nokucheba izinto ze-smartphone.
FAQ
Umbuzo: I-laser ye-UV isike njani ngokwahlukileyo kwi-CO2 okanye i-fiber laser?
A: CO2 kunye nefiber lasers zisebenzisa ubushushu ukunyibilika okanye ukufunxa izinto kodwa iUV laser isebenzisa inkqubo "ebandayo" ebizwa ngokuba yifoto{1}}ablation. Ubude bayo obufutshane kunye namandla aphezulu e-photon aphula iibhondi ze-molecular eziphathekayo ngokuthe ngqo, ukususa izinto eziphathekayo ngokuchanekileyo kunye nokudluliselwa kobushushu obuncinci kwindawo ejikelezileyo.
Q: Zeziphi izinto ezinokuthi i-laser ye-UV isikwe ngcono?
A: Iilaser ze-UV zigqwesa ekusikeni uluhlu olubanzi lwezinto ezithambileyo kunye nomngeni, kubandakanya:
● Iiplastiki kunye neePolymers: I-Polyimide (PI), i-PET, i-PEEK, i-PTFE, kunye nezinye iiplastiki zobunjineli.
● Iintsimbi eziNcinci neziNcincisayo: Ubhedu, ialuminiyam, igolide, iifoyile zesilivere ngaphandle kokubonisa umqadi.
● I-Ceramics: I-alumina, i-zirconia, kunye nezinye izixhobo ze-substrate ngaphandle kokuqhekeka okuncane.
● Iglasi kunye neSapphire: Ukucoca, ukusikeka okulawulwayo kunye nokugrunjwa ngaphandle kokuqhekeka.
● Izinto ze-Semiconductor: I-Silicon, i-gallium arsenide, kunye nezinye i-semiconductors edibeneyo.
Umbuzo: Uchaneke kangakanani umatshini wokusika we-UV laser?
A: Ukuchaneka komatshini wokusika we-UV laser kuphezulu kakhulu. Eyona ndawo incinci yokukhanya yokukhanya ingaba ngaphantsi kwe-20 um, kwaye i-cut cut incinci kakhulu. Oomatshini banokufikelela ukuchaneka kokubeka ± 3 um kunye nokuphindaphinda ukuchaneka kwe-±1 um, kunye nokuchaneka kwenkqubo ye-±20 um.
Umbuzo: Ziziphi iingenelo eziphambili zenkqubo "yokusika okubandayo"?
A: Iinzuzo eziphambili zezi
- Akukho Ukonakaliswa kweThermal: Iphelisa ukutshisa, ukunyibilika, kunye nobushushu{0}}obudala ukonakala.
- Umgangatho oPhezulu woMda: Uvelisa iindonga ezigudileyo, ezithe tye ngaphandle kwe-burrs okanye i-slag.
- I-HAZ encinci: Ikhusela imfezeko yemathiriyeli ejikeleze ukusikwa.
- Ukukwazi ukusika ubushushu{0}}Izinto eziSensitive Materials: Yenza ukusetyenzwa kwezinto ezinokuthi zitshatyalaliswe zii-laser ze-thermal.
Q: Loluphi uluhlu lobukhulu obuqhelekileyo bezinto ezisikwe ngelaser ye-UV?
A: Iilaser zeUV zenzelwe umsebenzi{0}}ochanekileyo kwizinto ezibhityileyo neziethe-ethe. Uluhlu olufanelekileyo luqhelekile ukusuka kwi-1 micron ukuya kwi-1-2 mm, kuxhomekeke kwizinto eziphathekayo. Azenzelwanga ukusika iipleyiti zetsimbi ezishinyeneyo okanye iibhloko.
Umbuzo: Ngaba inkqubo ye-laser ye-UV ikhuselekile ukusebenza?
A: Ngokuqinisekileyo. I-laser ivalwe ngokupheleleyo kwikhabhathi evaliweyo yokhuseleko, ukuqinisekisa ukuba akukho mitha ye-UV eyingozi inokubaleka ngexesha lokusebenza. Abasebenzisi bangalayisha ngokukhuselekileyo kwaye bakhuphe iinxalenye ngaphandle komngcipheko wokuvezwa.
Iifayile ezishisayo: Umatshini wokusika we-laser we-uv, i-China uv laser cutting machine abavelisi, ababoneleli, umzi-mveliso
IiParameters zobuGcisa
|
Umzekelo |
HT-UVC15 |
|
Amandla eLaser |
15 W |
|
Uhlobo lweLaser |
UV Laser |
|
Ubude beLaser |
355 nm |
|
Indawo yeNkqubo enye |
50×50 mm |
|
Uluhlu olupheleleyo loLungiselelo |
460 mm × 460 mm (Inokwenziwa ngokwezifiso) |
|
I-CCD ngokuzenzekela{0}}UkuChaneka koLungelelwaniso |
±3 μm |
|
Okuzenzekelayo -uMsebenzi wokuGqalisela |
Ewe |
|
XY -I-Axis Repositioning Ukuchaneka |
±1 μm |
|
XY -I-Axis Positioning Ukuchaneka |
±3 μm |
|
Iifomathi zeFayile ezixhaswayo |
DXF, DWG, GBR, CAD kunye nokunye |
